: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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PLC Control Efficient Chip Molding Machine In Semiconductor Manufacturing System

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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PLC Control Efficient Chip Molding Machine In Semiconductor Manufacturing System

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PLC Control Efficient Chip Molding Machine In Semiconductor Manufacturing System

Performance Parameters: ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● ...

Product Tags:

PLC Control Chip Molding Machine

PLC Control Semiconductor Manufacturing System

Efficient Chip Molding Machine

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