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: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Semiconductor Molding Machine,Trim And Form Machine

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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: Auto IC Scheduler Chip Sorting Machine Strong Wear Resistance

: Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

: Steel Nitriding Trimming Forming Dies Semiconductor Molding Molds

: 100 KW Semiconductor Molding Machine Automatic Encapsulation System

: 3.5kW Efficient Semiconductor Wafer Processing Equipment Chip Sorter Machine

: Stainless Steel DIP40 MGP Mould Semiconductor Packaging Mold

: Fast Processing Trim Form System Semiconductor Chip Making Machine

: High Precision Molding Molds Trim Form Mold High Efficiency Wear Proof

: High Durability Semiconductor Molding Machine Automated ISO9001 Approval

: Fully Automatic Sorter Semiconductor Chip Making Machine 220V/50Hz

: High Performance Durable DIP29/40 MGP Mold Tools Customized

: ISO9001 Certified Trim Form IC Manufacturing Machines Manual Auto Operation

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